The present invention provides an active light–sensitive or radiation-sensitive resin composition that includes an acid-labile resin (A) and a compound (B) that generates an acid when irradiated with active light or radiation, an active light–sensitive or radiation-sensitive resin film that is formed from the composition, a pattern formation method that uses the composition, and a production method for an electronic device. Compound (B) includes structural moieties X and Y, which are described in the description, and generates an acid that includes a first acidic moiety derived from structural moiety X and a second acidic moiety derived from structural moiety Y when irradiated with active light or radiation. For compound (B), a compound PI obtained by replacing a cationic moiety with H has acid dissociation constants a1 and a2 that result from an acidic moiety, a2 being larger than a1, and an anionic moiety of structural moiety Y is represented by formula (1), which is described in the description.
- 출원번호 : JP2024/030302
- 출원인 : FUJIFILM CORPORATION
- 특허번호 :
- IPC : G03F-007/004(2006.01);C07C-309/12(2006.01);C07C-309/22(2006.01);C07C-309/29(2006.01);C07C-309/41(2006.01);C07C-309/58(2006.01);C07C-309/65(2006.01);C07D-307/00(2006.01);C07D-317/08(2006.01);G03F-007/20(2006.01);G03F-007/038(2006.01);G03F-007/039(2006.01);