A process system for processing a substrate is proposed, comprising at least one irradiation device for irradiating a substrate, wherein the substrate is fed in at an entry region of the irradiation device and is guided in a predefined process direction and is loaded with radiation energy and process air, and wherein the substrate leaves the irradiation device at an exit region, and a circulating air nozzle dryer which is arranged so as to adjoin the exit region of the irradiation device in the process direction and to which the substrate is fed after leaving the irradiation device, and wherein the substrate runs through said dryer as far as a discharge region, wherein the circulating air nozzle dryer is configured to process the substrate, and wherein the circulating air nozzle dryer comprises: at least a first and a second circulating air module, each comprising an extraction unit and a feed air nozzle, and an air circulation element which is operatively connected to the at least two circulating air modules and is arranged and configured to circulate air received by the extraction unit of at least the first circulating air module and fed in to the former, and at least one heating element which is arranged and configured to control the temperature of the circulated air and to output it as feed air through the feed air nozzles of the circulating air modules in the direction of the substrate, wherein the last extraction unit in the process direction is not operatively connected to the air circulation element, and is configured to transport part of the feed air, output onto the substrate, to outside the circulating air system.
- 출원번호 : DE2024/100474
- 출원인 : ACKERMANN, Gunther
- 특허번호 :
- IPC : B41F-023/04(2006.01);F26B-003/28(2006.01);F26B-003/30(2006.01);F26B-013/10(2006.01);F26B-021/04(2006.01);F26B-021/10(2006.01);F26B-021/12(2006.01);F26B-023/00(2006.01);