The invention relates to a method for controlling laser cutting processes of a laser cutting machine using an imaging device for imaging a process zone of a laser cutting machine onto an image capture device, the method comprising the steps of: - capturing the radiation emitted from the process zone from a first and at least one second observation direction, the first and second observation directions being different from one another, and imaging, in a spatially separated manner, the radiation captured from the two observation directions in an image capture device; - based on the images, measuring the vertical position (Z) of elements (11, 12, 13, 14, 15, 22) in the process zone and/or measuring the vertical distance between elements (13, 14; 10, 11; 14, 15) using triangulation; - comparing the measured distances with target values and, in the event of deviations, initiating corrective measures and/or safety measures.
- 출원번호 : EP2024/060600
- 출원인 : TRUMPF WERKZEUGMASCHINEN SE + CO. KG
- 특허번호 :
- IPC : B23K-026/03(2006.01);B23K-026/38(2014.01);B23K-031/12(2006.01);