The present invention relates to a photosensitive resin composition, a 3D printed object formed therefrom, and a manufacturing method therefor and, more specifically, to a resin composition, a 3D-printed object formed therefrom, and a manufacturing method therefor, the resin composition comprising epoxy resin containing an epoxy compound having a specific structure or the epoxy compound as a polymerized unit, an alicyclic epoxy compound, an ethylenically unsaturated compound, a photopolymerization initiator, and a filler combined in a specific content ratio, and having excellent mechanical properties and heat resistance to be usable in manufacture of objects or parts used in high-temperature environments by means of radiation-based 3D printers.
- 출원번호 : KR2024/006227
- 출원인 : SAMYANG CORPORATION
- 특허번호 :
- IPC : C08L-063/00(2006.01);C08G-059/30(2006.01);C08G-059/24(2006.01);C08G-059/42(2006.01);C08L-101/00(2006.01);C08K-003/013(2018.01);C08K-005/1525(2006.01);B33Y-070/00(2015.01);B33Y-080/00(2015.01);B33Y-010/00(2015.01);