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  • 512251

    us

    An antenna may have features to ameliorate ice accumulation thereon. For instance, the antenna may include a feed structure between a reflector and a radome. The radome may cover at least a portion of the antenna and/or components of the antenna. A heating element may be located at various locations on the feed structure of the antenna. The heating element may heat the radome or other aspects of the antenna. The heating element may heat the radome or other aspects by infrared radiation, and/or via circulating warmed air. A fan may be provided to promote circulation of warmed air. The heat ameliorates ice accumulation the antenna so that ice accumulation does not diminish the electromagnetic performance of the antenna.
    • 출원번호 : 18830342
    • 출원인 : Viasat, Inc.
    • 특허번호 :
    • IPC : H01Q-001/02(2006.01);H01Q-001/42(2006.01);H01Q-019/19(2006.01);
  • 512250

    us

    For improved durability during use in a microwave oven, and at the same time, good readability of a smart label, it is provided that a flat RFID inlay made up of an RFID chip and an antenna is applied to a metal shield that is made up of at least two mutually overlapping foil sections. A recess in the foil sections is enclosed by the antenna of the RFID inlay. When such a smart label with the metal shield is applied in advance to a microwave dish, and a shielding element that is impermeable to microwave radiation in the microwave oven is temporarily overlaid on the smart label from the opposite side, such a smart label can be used in the microwave oven without damage, but remains readable outside the microwave oven, and without the shielding element.
    • 출원번호 : 18829505
    • 출원인 : Bohn, Martin
    • 특허번호 :
    • IPC : G06K-019/077(2006.01)
  • 512249

    us

    A first refrigeration cycle includes a first compressor, a first radiator, an air-conditioning expansion valve, an air-conditioning evaporator, a first expansion valve, and a first evaporator. In the first refrigeration cycle, a first refrigerant evaporates in at least one of the air-conditioning evaporator or the first evaporator. A second refrigeration cycle includes a second compressor, a second radiator, a second expansion valve, and a second evaporator. A heat transfer portion switches a heat radiation destination from the first radiator to a second refrigerant in the second evaporator or outside air. In the air-conditioning evaporator, the first refrigerant absorbs heat from ventilation air blown into a space to be air conditioned as the first refrigerant evaporates. In the first evaporator, the first refrigerant absorbs heat from the outside air as the first refrigerant evaporates. In the second radiator, the second radiator radiates heat from the second refrigerant to the ventilation air.
    • 출원번호 : 18829542
    • 출원인 : IJUIN, Yukihisa
    • 특허번호 :
    • IPC : B60H-001/00(2006.01);F25B-041/31(2006.01);F25B-049/02(2006.01);
  • 512248

    us

    A radiation-sensitive composition contains a polymer having an acid-releasable group, and a compound represented by formula (1). In the formula (1), A1 represents a (m+n+2)-valent aromatic ring group. Both —OH and —COO− are bound to a common benzene ring in A1. Atom to which —OH is bound is located next to an atom to which —COO31 is bound. R1 represents a monovalent group comprising a cyclic (thio)acetal structure. m is an integer of ≥0. n is an integer of ≥0. M+ represents a monovalent organic cation.
    • 출원번호 : 18829747
    • 출원인 : JSR CORPORATION
    • 특허번호 :
    • IPC : G03F-007/039(2006.01);G03F-007/22(2006.01);
  • 512247

    us

    In accordance with an embodiment, a semiconductor device includes: a radiator comprising a radiation layer configured to radiate an electromagnetic wave; a detector comprising a detection layer configured to detect the electromagnetic wave; a substrate; and an interface layer arranged between the radiator or the detector and the substrate, where a thermal conductivity of the radiator or the detector is different from a thermal conductivity of the interface layer.
    • 출원번호 : 18830121
    • 출원인 : Hauff, Michael
    • 특허번호 :
    • IPC : G01N-021/17(2006.01);H01L-031/12(2006.01);
  • 512246

    wo

    A lighting device (20) is disclosed, comprising a housing (5), a light-emitting unit (8), a radar sensor unit (4), and a surface structure (1) connected to the housing (5) via an intermediate element (2) arranged between the housing (5) and the surface structure (1). The light-emitting unit (8) is connected to the housing (5) and configured to, in operation, emit light into a chamber (12), defined at least in part by a surface (13) of the surface structure (1) and a surface (14) of the intermediate element (2), towards the surface structure (1). The radar sensor unit (4) is connected to the intermediate element (2) and configured to, in operation, transmit electromagnetic radiation in at least one wavelength range into the chamber (12) towards the surface structure (1). The surface structure (1) is transmissive for at least light and for electromagnetic radiation in the at least one wavelength range.
    • 출원번호 : EP2024/075219
    • 출원인 : SIGNIFY HOLDING B.V.
    • 특허번호 :
    • IPC : F21K-009/238(2016.01);F21V-017/06(2006.01);F21V-023/04(2006.01);F21Y-103/33(2016.01);F21Y-115/10(2016.01);
  • 512245

    wo

    A system provides for an ability to automatically identify one or more chemical components of a sample, especially a biological fluid sample, based on analysis of spectral data by at least one artificial intelligence module. The artificial intelligence module is able to be trained on a plurality of spectral data samples having known concentrations of individual chemicals and elements. The system is preferably used for spectral techniques such as UV/vis and near-infrared (NIR) spectrophotometry, but is also able to be used for other forms of spectroscopic techniques, including mass spectrometry, infrared (IR) spectrometry, X-ray spectroscopy, Raman spectrometry, or nuclear magnetic resonance (NMR) spectrometry.
    • 출원번호 : US2024/045977
    • 출원인 : VIONIX BIOSCIENCES INC.
    • 특허번호 :
    • IPC : G16B-040/00(2019.01);G06N-020/00(2019.01);
  • 512244

    wo

    Disclosed herein is a magnetic resonance imaging (MRI) magnet assembly. The magnet assembly comprises a two-stage cryo-cooling system, a primary coil, and a radiation shield assembly. The cryo-cooling system comprises a high-temperature stage and a low-temperature stage. The high- temperature stage is adapted for providing an upper working temperature. The primary coil is thermally coupled to the low-temperature stage. The radiation shield assembly is thermally coupled to the high- temperature stage, and comprises a shim coil and a radiation shield carrying the shim coil. The radiation shield is disposed in the cryostat to shield the primary coil from thermal radiation. When the shield assembly is in thermal equilibrium with the high-temperature stage, the radiation shield has the upper working temperature and thus shields the primary coil from thermal radiation that originates from temperatures above the upper working temperature.
    • 출원번호 : EP2024/075055
    • 출원인 : KONINKLIJKE PHILIPS N.V.
    • 특허번호 :
    • IPC : G01R-033/3875(2006.01);G01R-033/38(2006.01);G01R-033/3815(2006.01);
  • 512243

    wo


    • 출원번호 : CN2024/117685
    • 출원인 : SHANGHAI NUCLEAR ENGINEERING RESEARCH &DESIGN INSTITUTE CO., LTD.;
    • 특허번호 :
    • IPC : G21C-015/18(2006.01)
  • 512242

    ja

    PROBLEM TO BE SOLVED: To provide a method for high resolution radiation detection providing a reduced lag at a high frame rate.SOLUTION: A system for creating an image from incident radiation includes an upper electrode layer, a photoconducting layer, a pair of lower electrodes, a substrate layer, and a pair of pixel circuits integrated in the pair of lower electrodes. The photoconducting layer has a thickness of at least three times greater than the pitch of the individual pixel circuit.SELECTED DRAWING: Figure 2
    • 출원번호 : 2024155139
    • 출원인 : KA IMAGING INC
    • 특허번호 :
    • IPC : G01T-001/24(2006.01);G01T-001/20(2006.01);A61B-006/42(2024.01);H04N-025/30(2023.01);H01L-027/144(2006.01);H01L-027/146(2006.01);