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  • 510040

    wo

    A normal-temperature dyeing method, comprising providing a textile, an organic dye containing a carbon-carbon double-bond functional group, an organic monomer containing a carbon-carbon double-bond functional group, and an organic crosslinking agent containing at least two carbon-carbon double-bond functional groups; generating active radicals on the textile by means of ionizing radiation; and then the active radicals on the textile initiating graft polymerization and crosslinking of the carbon-carbon double-bond functional groups on the organic dye, the organic monomer and the organic crosslinking agent, so as to fix the organic dye on the textile by means of covalent bonds, thereby coloring the textile. The present invention further relates to a textile obtained on the basis of the normal-temperature dyeing method. According to the normal-temperature dyeing method of the present application, by initiating graft and crosslinking reaction by means of radiation, the organic dye is bonded to the textile by means of covalent bonds, and operation can be conducted at normal temperature; and compared with existing industrial conventional textile dyeing methods, energy consumption is greatly reduced, dyeing assistants such as salt and alkali do not need to be added in the dyeing process, and the reaction efficiency of the dye and the textile is high.
    • 출원번호 : CN2024/100617
    • 출원인 : TH TEXTILE GRAFTING (SZ) CO., LTD.
    • 특허번호 :
    • IPC : D06P-001/00(2006.01);D06P-005/20(2006.01);
  • 510039

    wo

    A method for producing an optoelectronic semiconductor chip (100) is specified herein, comprising the steps of: - epitaxially growing a semiconductor layer sequence (1) with an active layer (2) for emitting electromagnetic radiation, wherein the active layer (2) comprises a phosphide compound semiconductor material or an arsenide compound semiconductor material, - forming a via (3) in the semiconductor layer sequence (1) for electrically contacting the semiconductor layer sequence (1), - forming an electron and hole barrier (4) within the semiconductor layer sequence (1) at an edge (31) of the via (3). Further, an optoelectronic semiconductor chip is specified herein.
    • 출원번호 : EP2024/067464
    • 출원인 : AMS-OSRAM INTERNATIONAL GMBH
    • 특허번호 :
    • IPC : H01L-033/38(2010.01);H01L-033/00(2010.01);H01L-033/14(2010.01);H01L-033/30(2010.01);H01L-033/42(2010.01);H01L-033/46(2010.01);
  • 510038

    wo

    Apparatus and methods for curing adhesives in a robotic assembly cell and evaluating the curing at a same time or in parallel are disclosed. An apparatus in accordance with an aspect of the present disclosure comprises a radiation source configured to emit radiation to cure an adhesive in a curing area during an assembly process, a radiation guide configured to transmit the radiation emitted from the radiation source to the curing area, and a sensor configured to measure a reflection of the transmitted radiation reflected off the curing area during the curing of the adhesive, wherein the sensor is positioned proximate to the radiation guide; and a controller configured to determine whether the measured reflection satisfies a threshold and, based on a determination that the measured reflection does not satisfy the threshold, to signal a remedial action of the assembly process.
    • 출원번호 : US2024/035143
    • 출원인 : DIVERGENT TECHNOLOGIES, INC.
    • 특허번호 :
    • IPC : B05D-003/06(2006.01)
  • 510037

    wo

    The present disclosure relates to a radiation detector for detecting radiation. The radiation detector includes: a flexible first radiation detection panel which extends in a first direction and detects radiation incident on the front surface thereof; a flexible second radiation detection panel which extends in the first direction and detects radiation incident on the front surface thereof and in which at least a part of the rear surface of the first radiation detection panel overlaps at least a part of the front surface of the second radiation detection panel; and a plate-shaped main plate positioned on the rear surfaces of the first radiation detection panel and the second radiation detection panel to support at least a part of the first radiation detection panel and the second radiation detection panel.
    • 출원번호 : KR2024/008651
    • 출원인 : DRTECH CORPORATION
    • 특허번호 :
    • IPC : G01T-007/00(2006.01);G01T-001/24(2006.01);
  • 510036

    us

    The invention relates to a system for storing liquids, in particular for a household appliance, comprising at least one container for storing a liquid and at least one level measuring device, wherein the level measuring device comprises at least one radiation source device which emits electromagnetic radiation and at least one detection device for electromagnetic radiation, wherein the at least one container has a reflective element which has only one boundary surface with a fluid located in the container.
    • 출원번호 : 18750054
    • 출원인 : Schade, Lukas
    • 특허번호 :
    • IPC : G01F-023/292(2006.01)
  • 510035

    us

    Apparatus and methods for curing adhesives in a robotic assembly cell and evaluating the curing at a same time or in parallel are disclosed. An apparatus in accordance with an aspect of the present disclosure comprises a radiation source configured to emit radiation to cure an adhesive in a curing area during an assembly process, a radiation guide configured to transmit the radiation emitted from the radiation source to the curing area, and a sensor configured to measure a reflection of the transmitted radiation reflected off the curing area during the curing of the adhesive, wherein the sensor is positioned proximate to the radiation guide; and a controller configured to determine whether the measured reflection satisfies a threshold and, based on a determination that the measured reflection does not satisfy the threshold, to signal a remedial action of the assembly process.
    • 출원번호 : 18751093
    • 출원인 : BUROKAS, Vincent Arunas
    • 특허번호 :
    • IPC : B29C-064/165(2006.01);B33Y-010/00(2006.01);B33Y-040/20(2006.01);
  • 510034

    us

    In an example 3D printing method, an electrical conductivity value for a resistor is identified. Based upon the identified electrical conductivity value, a predetermined amount of a conductive agent is selectively applied to at least a portion of a build material layer in order to introduce a predetermined volume percentage of a conductive material to the resistor. Based upon the identified electrical conductivity value and the predetermined volume percent of the conductive material, a predetermined amount of a resistive agent is selectively applied to the at least a portion of the build material layer in order to introduce a predetermined volume percentage of a resistive material to the resistor. The build material layer is exposed to electromagnetic radiation, whereby the at least the portion coalesces to form a layer of the resistor.
    • 출원번호 : 18751092
    • 출원인 : Wittkopf, Jarrid A.
    • 특허번호 :
    • IPC : B29C-064/165(2006.01);B29C-035/08(2006.01);B29C-070/88(2006.01);B29K-105/16(2006.01);B29K-505/00(2006.01);B29L-031/34(2006.01);B33Y-010/00(2006.01);B33Y-070/00(2006.01);H01C-017/065(2006.01);
  • 510033

    wo

    The invention relates to a method for manipulating pulsed laser radiation (2), having the following steps: - providing pulsed laser radiation (2); - spatially separating the frequency components of the pulsed laser radiation (2) to a first predetermined extent in a direction perpendicular to a propagation direction of the pulsed laser radiation (2); - guiding pulsed laser radiation (2), spatially separated to the first predetermined extent, to a multiple-pass gas cell (8); - increasing the spectral bandwidth of the pulsed laser radiation (2) in the multiple-pass gas cell (8) for temporal pulse compression of the pulsed laser radiation (2). The invention also relates to a corresponding device (1).
    • 출원번호 : AT2024/060242
    • 출원인 : TECHNISCHE UNIVERSITÄT WIEN;
    • 특허번호 :
    • IPC : H01S-003/00(2006.01);H01S-003/23(2006.01);
  • 510032

    wo

    Use of a composite material of bismuth oxycarbonate and inorganic compounds for filtering ultraviolet radiation The present invention relates to the use of a composite material comprising at least a) particles of bismuth oxycarbonate of formula (I) (BiO)(CO), and solvates thereof, such as hydrates thereof, in which -0.4 < < 0.6, the largest mean dimension of said particles being less than 400 nm; and b) at least one inorganic compound chosen from oxides and/or hydroxides of formula [(M) O(OH)] (HO) for filtering UV-A and/or UV-B radiation, preferably UV-B radiation, and to composite materials, the process for preparing same, and compositions employing same.
    • 출원번호 : EP2024/067559
    • 출원인 : L'OREAL
    • 특허번호 :
    • IPC : A61K-008/02(2006.01);A61K-008/19(2006.01);A61K-008/25(2006.01);A61K-008/29(2006.01);A61Q-017/04(2006.01);
  • 510031

    wo

    The present invention provides a method of forming a 3D object, the method comprising: providing a photo-curable resin, providing a print head for transmitting curing radiation to the photo-curable resin, the print head having a cavity containing gas, introducing the print 5 head into the resin to form a submerged gas-resin interface between the gas and the resin, wherein said gas-resin interface is constrained to the print head and defines a printing surface, projecting curing radiation on the submerged gas-resin interface to promote curing of the resin at the printing surface, and promoting relative movement between the gas-resin interface and the resin to produce the 3D object. The method may also include a step of 10 transmitting acoustic waves to the submerged gas-resin interface.
    • 출원번호 : AU2024/050654
    • 출원인 : THE UNIVERSITY OF MELBOURNE
    • 특허번호 :
    • IPC : B29C-064/268(2017.01);B29C-064/135(2017.01);B29C-064/209(2017.01);B29C-064/371(2017.01);B33Y-010/00(2015.01);B33Y-030/00(2015.01);B33Y-080/00(2015.01);C08B-037/00(2006.01);C08F-222/10(2006.01);C08H-001/06(2006.01);C12N-005/00(2006.01);C12N-005/071(2010.01);