The invention relates to a microwave-assisted processing apparatus (10), having a deformation apparatus (8) designed to change the shape of, in particular to divide up, a body (7) having one or more hard-material components, and a microwave heating device (1) designed to heat the body assisted by microwave technology, having: - a plurality of microwave antennas (2a – 2n) which are designed and arranged in a group such that a. no relative movement is possible between the microwave antennas, and, at the same time, b. microwave radiation (5), the direction, distribution and intensity of which are able to be oriented, can be irradiated via said microwave antennas onto the body, - a plurality of semiconductor-based power amplifiers (3, 3a-3n) each designed to amplify a microwave signal, which can be specified to said power amplifiers, to a microwave power of greater than or equal to 100 W, wherein - each microwave antenna is connected to at least one semiconductor power amplifier, and - the power amplifiers can be adjusted with respect to one another in terms of their power output and phase, wherein - the orientation and emission characteristics of the microwave antennas and the adjustability of the power amplifiers are designed such that, in the body, a non-uniform temperature distribution is generated for generating thermal stresses in the lattice structures of the body.
- 출원번호 : EP2024/060087
- 출원인 : TRUMPF HÜTTINGER GMBH + CO. KG;
- 특허번호 :
- IPC : H05B-006/68(2006.01);H05B-006/70(2006.01);H05B-006/80(2006.01);