PROBLEM TO BE SOLVED: To provide a radiation-sensitive composition that can form a film excelling in development adhesion and curing adhesion.SOLUTION: A radiation-sensitive composition comprising (A-1) a polymer including a structural unit having a group represented by the formula (1) or an acid-dissociable group, (B-1) a photoacid generator, (C-1) a solvent, and (E) a compound having at least one functional group (X) selected from the group consisting of an alkoxysilyl group, an oxetanyl group, a mercapto group, a (meth)acryloyl group, a vinyl group, and an amino group, and having a cardo structure, wherein in the formula (1), R1, R2, and R3 each represent a hydrogen atom, a halogen atom, a hydroxy group, a C1-6 alkoxy group, a C1-10 alkyl group, or a phenyl group, provided that at least one of R1, R2, and R3 is a C1-6 alkoxy group.SELECTED DRAWING: None
- 출원번호 : 2025135947
- 출원인 : JSR CORP
- 특허번호 :
- IPC : G03F-007/027(2006.01);G03F-007/075(2006.01);G03F-007/039(2006.01);G03F-007/038(2006.01);G03F-007/004(2006.01);G03F-007/023(2006.01);C08F-020/10(2006.01);C08F-012/02(2006.01);C08F-020/04(2006.01);C07F-007/18(2006.01);