A method of bonding first and second substrates to each other, the substrates having respective bonding surfaces to be bonded together, comprising: (a) applying to the bonding surface of at least the first substrate a redox-active metal catalyst primer to form a primed surface; (b) activating the primed bonding surface of the first substrate by exposing the primed bonding surface to actinic radiation; (c) applying, to the so activated bonding surface of the first substrate, and/or or to the bonding surface of the second substrate, an anaerobically curable adhesive which is a non-UV curable anaerobic adhesive; and (d) mating the bonding surfaces together with the non-UV curable anaerobically curable adhesive there between; wherein at least one substrate is an e-coated steel substrate having one of the following coatings in accordance with AISI-ASTM A 976-9: C0, C2, C3, C3A, C4, C4A, C4AS, C5, C5A, C5AS, C6.
- 출원번호 : EP2024/065785
- 출원인 : HENKEL AG &CO. KGAA;
- 특허번호 :
- IPC : C09J-005/02(2006.01);C09J-007/28(2018.01);C09J-007/50(2018.01);C09J-133/10(2006.01);