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  • 506478

    us

    A method for detecting a leak in a cladding tube in a nuclear reactor is described. The method is well-suited for use in a reactor having a plurality of cladding tubes housed in a plurality of linearly arranged channels for flowing coolant past the cladding tubes. The method includes monitoring the channels for the occurrence of an increase in radiation above a selected base line indicative of the presence of at least one fission product in the coolant in at least one of the plurality of channels, and monitoring the channels for the occurrence of time dependent changes in the strength of radiation in the coolant above the base line along the length of the at least one of the plurality of channels. The leak location is calculated by triangulating the radiation readings from a fixed linear array of detectors positioned adjacent to the channels to determine the location of the strongest radiation reading and the location along the length of the channel where the increase in radiation occurred.
    • 출원번호 : 18780273
    • 출원인 : Westinghouse Electric Company LLC
    • 특허번호 :
    • IPC : G21C-017/04(2006.01);G01T-001/24(2006.01);G21C-017/10(2006.01);H01L-031/10(2006.01);H01L-031/115(2006.01);
  • 506477

    us

    An electronic device is provided. The electronic device includes a first housing structure including a first side surface member, a second housing structure including a second side surface member, a hinge structure configured to rotatably connect the first housing structure and the second housing structure and configured to provide a folding axis on which the first housing structure and the second housing structure rotate, and at least one printed circuit board, wherein the first side surface member or the second side surface member includes a first side surface portion a second side surface portion, a third side surface portion, a fourth side surface portion, a fifth side surface portion, a first slit a second slit a third slit, and a fourth slit, and a fifth slit, and wherein at least part of at least one of the second side surface portion, the third side surface portion, and the fourth side surface portion is formed of a radiation conductor and is electrically connected to the at least one printed circuit board.
    • 출원번호 : 18779665
    • 출원인 : YOON, Shinho
    • 특허번호 :
    • IPC : H01Q-001/24(2006.01);G06F-001/16(2006.01);H01Q-001/42(2006.01);H01Q-001/48(2006.01);H01Q-013/16(2006.01);H04M-001/02(2006.01);
  • 506476

    us

    The present disclosure relates to a method and an associated process tool. The method includes generating electromagnetic radiation that is directed toward a perimeter of a pair of bonded workpieces and toward a radiation sensor that is arranged behind the perimeter of the pair of bonded workpieces. The electromagnetic radiation is scanned along a vertical axis. An intensity of the electromagnetic radiation that impinges on the radiation sensor is measured throughout the scanning. Measuring the intensity includes recording a plurality of intensity values of the electromagnetic radiation at a plurality of different positions along the vertical axis extending past top and bottom surfaces of the pair of bonded workpieces. A position of an interface between the pair of bonded workpieces is determined based on a maximum measured intensity value of the plurality of intensity values.
    • 출원번호 : 18779172
    • 출원인 : Hsiao, Hau-Yi
    • 특허번호 :
    • IPC : H01L-021/66(2006.01);G01N-021/95(2006.01);H01L-021/56(2006.01);
  • 506475

    us

    The present disclosure relates to an integrated chip including a substrate and a pixel. The pixel includes a photodetector. The photodetector is in the substrate. The integrated chip further includes a first inner trench isolation structure and an outer trench isolation structure that extend into the substrate. The first inner trench isolation structure laterally surrounds the photodetector in a first closed loop. The outer trench isolation structure laterally surrounds the first inner trench isolation structure along a boundary of the pixel in a second closed loop and is laterally separated from the first inner trench isolation structure. Further, the integrated chip includes a scattering structure that is defined, at least in part, by the first inner trench isolation structure and that is configured to increase an angle at which radiation impinges on the outer trench isolation structure.
    • 출원번호 : 18778992
    • 출원인 : Huang, Cheng Yu
    • 특허번호 :
    • IPC : H01L-027/146(2006.01);H01L-031/107(2006.01);
  • 506474

    us

    Light-emitting device (1) includes waveguide structure (5) and exterior part (4). Waveguide structure (5) includes light receiving surface (51) including incident end surface (31) and first surface (41), and radiation surface (52) including emission end surface (32) and second surface (42). A position of waveguide structure (5) with respect to light source (2) is determined to cause light (L1) to be incident on light receiving surface (51). Incident range (R) on which light (L1) is incident on light receiving surface (51) includes at least a part of incident end surface (31) and at least a part of first surface (41) such that a part of light (L1) is incident on incident end surface (31) and another part of light (L1) is incident on first surface (41), passes through exterior part (4), and is emitted from second surface (42).
    • 출원번호 : 18779051
    • 출원인 : NISHIKAWA, YUKIO
    • 특허번호 :
    • IPC : H01S-005/02253(2006.01)
  • 506473

    us

    A method of additive manufacturing of a three-dimensional object, comprises: dispensing from a first array of nozzles a modeling material formulation containing a polyimide precursor to form a layer in a configured pattern corresponding to a shape of a slice of the object; applying to the layer ultraviolet radiation and infrared radiation from two different radiation sources; and repeating the dispensing and the application of radiation to form a plurality of layers in configured patterns corresponding to shapes of other slices of the object. Optionally, an additional modeling material formulation or a support material formulation is dispensed from a second array of nozzles.
    • 출원번호 : 18777593
    • 출원인 : Stratasys Ltd.
    • 특허번호 :
    • IPC : B29C-064/129(2006.01);B29C-064/209(2006.01);B29C-064/277(2006.01);B29C-064/393(2006.01);B29K-079/00(2006.01);B33Y-010/00(2006.01);B33Y-030/00(2006.01);B33Y-050/02(2006.01);C08G-073/12(2006.01);
  • 506472

    us

    In the context of forming radiation patternable structures especially for EUV patterning, wafer structures are described comprising a substrate having a smooth top surface and a radiation sensitive organometallic coating having an average thickness of no more than 100 nm and no more than about 1 defect per square centimeter with a defect size of greater than 48 nm, evaluated with a 3 mm edge exclusion. Corresponding methods for forming a low defect coating comprise spin coating a purified radiation sensitive organometallic resist solution onto a wafer using a spin coater system comprising a delivery line and a delivery nozzle connected to the delivery line to form a coated wafer, and drying the coated wafer to form a radiation sensitive organometallic coating having no more than about 1 defect per square centimeter with a defect size of greater than 48 nm, evaluated with a 3 mm edge exclusion. Methods are provided for improved filtering for particle removal from radiation patternable organometallic resist compositions.
    • 출원번호 : 18778388
    • 출원인 : Clark, Benjamin L.
    • 특허번호 :
    • IPC : G03F-007/004(2006.01);G03F-007/16(2006.01);
  • 506471

    us

    A hyperspectral imaging apparatus based on a monolithic or free space optical spatial heterodyne spectrometer (SHS) design, array detector, electromagnetic radiation source, and optical collection element is described. The apparatus enables the simultaneous acquisition of spatially isolated Fizeau fringe patterns, each having an encoded light product that is decoded to produce a spectral fingerprint of the interrogated object. Features specific to the SHS, such as a large entrance aperture, large acceptance angle, and no moving parts, enable a variety of optical collection schemes including lens arrays, solid-core and hollow core waveguides, and others. In one example, a microlens array (MLA) is configured with the hyperspectral imaging apparatus to simultaneously image many hundred spatially isolated Fizeau fringe patterns while interrogating an object using an electromagnetic radiation source. Each Fizeau fringe pattern recorded by the array detector is decoded to produce a full Raman or laser-induced breakdown spectroscopy (LIBS) spectrum. Compared to prior art, the hyperspectral imaging apparatus overcomes the primary limitations of needing to trade time resolution for both spectral and spatial data density because the imaging apparatus simultaneously acquires both spectral and special information. Based on the selection and configuration of diffraction gratings, the grating aperture size, Littrow wavelength (i.e., heterodyne wavelength), and optical collection configuration, the apparatus can be tailored to produced low or high spectral resolution with a spectral bandpass that covers a portion or the entire Raman spectral range (up to 4200 cm−1) and for LIBS as well.
    • 출원번호 : 18778560
    • 출원인 : ANGEL, STANLEY MICHAEL
    • 특허번호 :
    • IPC : G01N-021/65(2006.01)
  • 506470

    ko

    활성제를 저용량으로 포함하는 방법, 조성물, 및 키트를 포함한, 개체에서 방사선 요법 및/또는 화학요법 노출과 연관된 하나 이상의 부작용을 치료 및/또는 예방하기 위한 방법, 조성물, 및 키트가 개시된다. 일부 구체예에서, 활성제를 저용량으로 포함하는 방법, 조성물, 및 키트를 포함한, 개체에서 조직 손상을 치료 및/또는 예방하기 위한 방법, 조성물, 및 키트가 제공된다.
    • 출원번호 : 10-2024-7024244
    • 출원인 : 바이오미매틱스 제이브이, 엘엘씨;듀크 유니버시티;
    • 특허번호 :
    • IPC : A61K-031/555;A61K-031/495;A61K-033/243;A61K-045/06;A61P-001/02;A61P-017/00;A61P-017/14;A61P-025/28;A61P-035/00;A61P-043/00;
  • 506469

    ko

    본 발명은 기체유입부와 기체유출부를 가진 외함과, 상기 외함 내 마련되어 상기 기체유입부를 통해 유입된 유체의 수소와 반응하여 물로 재결합하는 촉매구조체를 포함하는 피동촉매형 수소 재결합 장치에 있어서, 상기 기체유출부는, 상기 외함의 전면 상부와 적어도 일 측면 상부에 마련되는 것을 특징으로 하는 피동촉매형 수소 재결합 장치를 제공한다.
    • 출원번호 : 10-2024-0095227
    • 출원인 : (주) 세라컴
    • 특허번호 :
    • IPC : G21C-009/06