A multilayer circuit board includes an insulating base including insulating layers, and first and second main surfaces facing each other in a stacking direction, conductor layers between the insulating layers, or on the first main surface, or on the second main surface, interlayer connection conductors penetrating at least one of the insulating layers, a mounting electrode on the first main surface, and a radiation electrode located closer to the second main surface than the mounting electrode. The conductor layers include first, second, third, and fourth conductor layers each including Cu foil. The interlayer connection conductors include one or more first interlayer connection conductors sandwiched between the first and second conductor layers in the stacking direction, and one or more second interlayer connection conductors sandwiched between the third and fourth conductor layers. in the stacking direction.
- 출원번호 : 19343278
- 출원인 : FURUMURA, Tomohiro
- 특허번호 :
- IPC : H05K-001/02(2006.01);H05K-001/09(2006.01);