A package structure includes a semiconductor die, an antenna substrate structure, a redistribution layer. The semiconductor die laterally encapsulated by a first encapsulant. The antenna substrate structure disposed over the semiconductor die, wherein the antenna substrate structure includes a first type of antenna, and a second type of antenna disposed on a side of the antenna substrate structure facing away from the semiconductor die. The redistribution layer disposed between the semiconductor die and the antenna substrate structure. The semiconductor die, the first type of antenna, and the second type of antenna are electrically coupled through the redistribution layer. The polarization of radiation emitted by the first type of antenna is perpendicular to a polarization of radiation emitted by the second type of antenna.
- 출원번호 : 18774903
- 출원인 : Taiwan Semiconductor Manufacturing Company, Ltd.
- 특허번호 :
- IPC : H01L-025/16(2006.01);H01L-021/56(2006.01);H01L-023/00(2006.01);H01L-023/31(2006.01);H01L-023/48(2006.01);H01L-023/552(2006.01);H01L-023/66(2006.01);H01Q-009/04(2006.01);H01Q-009/16(2006.01);H01Q-021/06(2006.01);H01Q-021/08(2006.01);